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Exploded view of the Apple iPhone 6 Plus after a product teardown by iFixit in Australia September 19, 2014. [Photo/Agencies] |
Taiwan-based Digitimes reports that Apple will adopt 0.4t (with a dimension of 3x0.85x0.4mm) LED chips for its backlight units, in order to make its iPhone even thinner than the previous generation.
The report suggests that Apple will use 0.4t LED chips from Japan-based Nichia and Toyoda Gose.
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